JPH0523710B2 - - Google Patents

Info

Publication number
JPH0523710B2
JPH0523710B2 JP61189582A JP18958286A JPH0523710B2 JP H0523710 B2 JPH0523710 B2 JP H0523710B2 JP 61189582 A JP61189582 A JP 61189582A JP 18958286 A JP18958286 A JP 18958286A JP H0523710 B2 JPH0523710 B2 JP H0523710B2
Authority
JP
Japan
Prior art keywords
sensor
temperature sensor
heater
moisture
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61189582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347644A (ja
Inventor
Hozumi Nita
Satoru Mokude
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP18958286A priority Critical patent/JPS6347644A/ja
Publication of JPS6347644A publication Critical patent/JPS6347644A/ja
Publication of JPH0523710B2 publication Critical patent/JPH0523710B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content

Landscapes

  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
JP18958286A 1986-08-14 1986-08-14 水分センサー Granted JPS6347644A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18958286A JPS6347644A (ja) 1986-08-14 1986-08-14 水分センサー

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18958286A JPS6347644A (ja) 1986-08-14 1986-08-14 水分センサー

Publications (2)

Publication Number Publication Date
JPS6347644A JPS6347644A (ja) 1988-02-29
JPH0523710B2 true JPH0523710B2 (en]) 1993-04-05

Family

ID=16243738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18958286A Granted JPS6347644A (ja) 1986-08-14 1986-08-14 水分センサー

Country Status (1)

Country Link
JP (1) JPS6347644A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11304739A (ja) * 1998-04-16 1999-11-05 Kasen Joho Center 湿潤度分布測定方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0544772Y2 (en]) * 1988-03-25 1993-11-15
JPH0214060U (en]) * 1988-07-13 1990-01-29
JPH0650764Y2 (ja) * 1989-10-25 1994-12-21 矢崎総業株式会社 比熱式水分センサ
US7465087B2 (en) * 2005-12-02 2008-12-16 Mamac Systems, Inc. Armoured flexible averaging temperature sensor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5341494Y2 (en]) * 1973-06-15 1978-10-06

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11304739A (ja) * 1998-04-16 1999-11-05 Kasen Joho Center 湿潤度分布測定方法

Also Published As

Publication number Publication date
JPS6347644A (ja) 1988-02-29

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